Titre : Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A


Paul H Townsend. Editeur scientifique
Materials Research Society (USA). Spring Meeting : Symposium M1 ; 1993 ; San Francisco, Calif
Pittsburg (Pa)
Materials Research Society
cop. 1993
xvii, 778 p ; 24 cm

xx Couches minces-- Propriétés mécaniques -- Congrès
1-55899-204-91-558-99204-9

Stresses in thin films. Measuring stresses and mechanical properties : new techniques and developments. Stress, electromigration and voiding in fine line structures. Stress relaxation mechanisms and thin film morphology. Mechanics and microstructure in epitaxial layers. Mechanical behaviour of polymer coatings. Mechanics deformation of thin films, the effects of microstructure and processing. Fracture, adhesion, and wear of thin films, the effets of microstructure and processing. The mechanical deformation of multilayer thin films
Notes bibliogr. Index

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