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Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A / ed. Paul H. Townsend... [et al.]

Auteur secondaire : : Townsend, Paul H, Editeur scientifiqueAuteur secondaire collectivité : Materials Research Society, USA, Spring Meeting, 1993, Symposium M1Publication :Pittsburg (Pa) : Materials Research Society, cop. 1993Description : xvii, 778 p ; 24 cmISBN : 1-55899-204-9 ; 1-558-99204-9.Dewey: 621.38Bibliographie: Notes bibliogr. Index.Sujet - Nom d'actualité : Couches minces -- Propriétés mécaniques -- Congrès Sujet : Usure ;Rupture ;Relaxation contrainte ;Propriété mécanique ;Polymère ;Microstructure ;Méthode mesure ;Matériau revetement ;Déformation ;Couche multiple ;Couche mince ;Couche epitaxique ;Contrainte interne ;Adhérence
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EMC 3599 Sur demande Bibliotheque de Corbeil

Stresses in thin films. Measuring stresses and mechanical properties : new techniques and developments. Stress, electromigration and voiding in fine line structures. Stress relaxation mechanisms and thin film morphology. Mechanics and microstructure in epitaxial layers. Mechanical behaviour of polymer coatings. Mechanics deformation of thin films, the effects of microstructure and processing. Fracture, adhesion, and wear of thin films, the effets of microstructure and processing. The mechanical deformation of multilayer thin films

Notes bibliogr. Index

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